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High Moisture Accelerated Mechanical Behavior Degradation of Phosphor/Silicone Composites Used in White Light-Emitting Diodes

机译:白光发光二极管用磷/硅树脂复合材料的高水分加速机械性能降解

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摘要

In a high-power white light emitting diode (LED) package, the phosphor/silicone composite is typically used for photometric and colorimetric conversions, ultimately producing the white light. However, the phosphor/silicone composite is always exposed under harsh environments with high temperature, high blue light irradiation and high moisture when the LED operates. Therefore, its reliability issue has become one of the critical bottlenecks to improve the lifetime of a high-power white LED package. As the curing process and mechanical behavior of phosphor/silicone composite essentially determine its reliability, this paper firstly uses an in situ viscosity monitoring approach combined with Differential Scanning Calorimetry (DSC) and Fourier Transform Infrared Spectroscopy (FTIR) analysis to explain the curing mechanism of a phosphor/silicone composite by taking the effects of temperature and phosphor mass fraction into consideration. Then, the mechanical properties of phosphor/silicone composites aged under a long-term high moisture condition are evaluated by using the tensile test. Meanwhile, the finite element (FE) simulations, the Mori–Tanaka theoretical estimations and the microstructure analysis are applied to investigate the high moisture induced degradation mechanisms. The results show that: (1) the in situ measured isothermal viscosity curves of both pristine silicone and phosphor/silicone composites follow the Arrhenius empirical model, and high temperature and high phosphor mass fraction can increase the curing rate; (2) the hydrosilylation reaction between silicones determines the curing mechanism of phosphor/silicone composite; (3) the tensile test, FE simulation and Mori–Tanaka theoretical prediction results confirm that the Young’s modulus of phosphor/silicone composite increases by gradually adding phosphors; and (4) the Young’s modulus of phosphor/silicone composite increases after the high moisture ageing test, which can be attributed to the oxidation and cross-linking reaction of silicone and the hydrolysis of phosphor powders.
机译:在高功率白光发光二极管(LED)封装中,磷光体/有机硅复合材料通常用于光度和色度转换,最终产生白光。然而,当LED工作时,磷光体/硅氧烷复合物总是暴露在高温,高蓝光辐射和高湿气的恶劣环境下。因此,其可靠性问题已成为提高高功率白光LED封装寿命的关键瓶颈之一。由于磷/硅树脂复合材料的固化过程和机械性能在很大程度上决定了其可靠性,因此本文首先结合差示扫描量热法(DSC)和傅立叶变换红外光谱(FTIR)分析结合原位粘度监测方法来解释其固化机理。通过考虑温度和磷光体质量分数的影响来制造磷光体/有机硅复合材料。然后,通过拉伸试验评价在长期高湿条件下老化的荧光粉/硅氧烷复合材料的机械性能。同时,利用有限元(FE)模拟,Mori–Tanaka理论估计和微观结构分析来研究高水分引起的降解机理。结果表明:(1)原始有机硅和荧光粉/有机硅复合材料的原位等温粘度曲线均遵循Arrhenius经验模型,高温和高荧光粉质量分数可以提高固化速率。 (2)有机硅之间的氢化硅烷化反应决定了荧光粉/有机硅复合材料的固化机理。 (3)拉伸试验,有限元模拟和森-田中理论预测结果证实,逐渐添加磷光体可提高磷光体/硅氧烷复合材料的杨氏模量; (4)高湿老化试验后,荧光粉/有机硅复合材料的杨氏模量增加,这可归因于有机硅的氧化和交联反应以及荧光粉的水解。

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