Selective Soldering: Wave Soldering Redefined

摘要

Surface-mount technology may continue evolving, with newer and more extensive packaging, but through-hole mounted components still appear in many applications. More and more Type I printed circuit board assemblies, comprised completely of surface-mount components, exist, but the vast majority of the industry is building applications featuring through-hole components. The majority of the surviving classes of through-hole components are those that must endure rather rough service. Switches, connectors and some sockets may have to endure mechanical stressing that demands the robustness of a through-hole interconnection. Some applications call for components with high-power ratings that do not exist, as of yet, in surface-mount form. So, what is the best way to solder mixed technology (surface-mount and through-hole populated) printed circuit board assemblies (PCBAs)?