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Spectroscopic and Thermal Analysis of Halogen-free Printed Circuit Boards

机译:无卤印刷电路板的光谱和热分析

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Results of an investigation of halogen-free and conventional PCB boards, comparing various base materials of FR-4 grade and halogen-free grades from different material suppliers. Electronic equipment manufacturers have started focusing on "environmentally friendly" products. Many arguments were discussed regarding potential leaching out of lead from disposed electronic equipment. Waste treatment, such as incineration of organic material, directed additional attention to halogens contained in many electronic appliances as flame retardants. Gas phase mechanism of halogens, and it is mainly bromine, was historically one of most efficient ways to improve flame retarding properties of polymers. However, as some halogenated compounds tend to promote the formation of carcinogens as polychlorinated dibenzodioxines, PCDD, and polychlorinated dibenzofuranes, PCDF, and their derivatives, halogens are increasingly banned from all sorts of goods. Parallel to the voluntary action of electronic manufacturers, there exists legislation to ban both lead from solder and interconnects and halogens from polymer materials. Currently, the European law makers are discussing limiting the maximum contents in electronic products for lead and for halogen products, effective from 2006-2007.
机译:无卤和传统PCB板的调查结果,比较了不同材料供应商提供的FR-4级和无卤等级的各种基础材料。电子设备制造商已开始专注于“环保”产品。讨论了许多有关废弃电子设备中铅可能浸出的争论。废物处理(例如焚化有机材料)使人们更加关注许多电子设备中包含的卤素作为阻燃剂。卤素(主要是溴)的气相机理一直以来都是提高聚合物阻燃性能的最有效方法之一。但是,由于某些卤代化合物往往会促进致癌物的形成,如多氯代二苯并二恶英PCDD和多氯代二苯并呋喃PCDF及其衍生物,因此越来越多的商品禁止使用卤素。与电子制造商的自愿行动并行的是,有立法禁止焊料和互连中的铅以及聚合物材料中的卤素。当前,欧洲立法者正在讨论限制从2006年至2007年生效的铅和卤素产品的电子产品中的最大含量。

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