A discussion of how the IC, and electrical performance considerations influence material property and interconnect architecture requirements, using a CTQ (critical to quality) flow-down approach. Integrated Circuits (ICs, chips) are "packaged," i.e., they are connected, or wired to first, second, and third level interconnect structures to become functional electronic devices (Figure 1). Advances in ICs have been driving changes in package structures, material requirements, and feature sizes. This article attempts to show how the IC, and electrical performance considerations influence material property and interconnect architecture requirements, using a CTQ (critical to quality) flow-down approach.
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