Removal of lead-based solders as mandated by RoHS initiatives has created a need for PCB materials that withstand high processing temperatures. A great deal of attention has been given to the traditional PCB market where suppliers of FR4-type products compete to introduce material systems that are completely "lead-free capable." New lead-free capable products are introduced on a frequent basis— almost as frequent as explanations why previously launched products failed to meet advertised expectations. The explanations have touched upon the effect of curing agents and other additives, applicability of test procedures, new rules proposed for designers, tightened tolerances during circuit fabrication, and additional processing requirements forced upon contract manufacturers.
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