A novel copper electroplating formula for laser-drilled micro via and through hole filling

摘要

Printed circut boards (PCBs) have diminished in size and, simultaneously, their circuit densities have increased. Conventional multi-layered PCBs have a limitation to higher packaging densities. This paper introduces a new copper electroplating formula that is able to fill vias and through holes simultaneously and is used in a DC plating method, in which the copper thickness deposited on the board surface is relatively very thin after the electroplating is completed.