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Micro UHMW-PE column array molded by the utilization of PCB as mold insert

机译:利用PCB作为模具嵌件模制的微型UHMW-PE柱阵列

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摘要

Purpose - The purpose of this paper is to present a method for ultrasonically molding polymer powder in a micro plastic part mold. In the method, a printed circuit board (PCB) in which micro-hole arrays are drilled is used as a micro cavity insert. With the utilization of ultrasonic vibration, the polymer powder, which is prefilled and compacted in a micro cavity, mutually generates great sliding friction heat so as to be rapidly plasticized and molded. Design/methodology/approach - Micro carbide drill bits of which the diameters are 100.0 /am, 150.0 /am and 200.0 /am, respectively, are used for drilling the PCB to form a micro-hole array insert. Next, two kinds of various ultra-high molecule weight polyethylene (UHMW-PE) powder with various grain diameters are directly filled into a charging barrel and a mold cavity with the micro-hole array insert. Proper process parameters are set on ultrasonic plasticizing and molding equipment so that a molding test can be performed. The melt of UHMW-PE can be rapidly filled into the cavity. Finally, micro-column array plastic parts are successfully prepared. Findings - The micro-hole array PCB is a mold insert which is quite applicable for the ultrasonic molding of the powder in the mold. When a molding material is the coarse UHMW-PE powder with the grain diameter of about 350/am, the diameter replication rates of the micro-column array plastic parts become good in order with the increased micro-hole diameter of the PCB. When the fine UHMW-PE powder with the grain diameter of about 80 /am is adopted, the diameter replication rates of the micro-column array plastic parts become good in order with the decreased micro-hole diameter of the PCB. Originality/value - In this paper, the micro-column array plastic parts with good replicability are successfully prepared by a technique for ultrasonically plasticizing and molding in the cavity. The technique can be applied to the fields of medical treatment, communication, optics, chemistry and so on, such as biological micro needle arrays, micro biological chips, optical memories, and micro chemical reaction chips.
机译:目的-本文的目的是提出一种在微塑料零件模具中超声成型聚合物粉末的方法。在该方法中,其中钻有微孔阵列的印刷电路板(PCB)被用作微腔插入物。通过利用超声波振动,在微腔中预填充并压实的聚合物粉末相互产生很大的滑动摩擦热,从而被快速塑化和模制。设计/方法/方法-直径分别为100.0 /am、150.0 / am和200.0 / am的微型硬质合金钻头用于在PCB上钻孔以形成微孔阵列插件。接着,将具有各种粒径的两种各种超高分子量聚乙烯(UHMW-PE)粉末直接填充到带有微孔阵列插入物的装料桶和模具型腔中。在超声波塑化和成型设备上设置适当的工艺参数,以便可以执行成型测试。 UHMW-PE的熔体可以快速填充到型腔中。最后,成功制备了微柱阵列塑料零件。研究结果-微孔阵列PCB是一种模具插件,非常适用于模具中粉末的超声成型。当模制材料是粒径约为350 / am的UHMW-PE粗粉时,随着PCB的微孔直径增加,微柱阵列塑料部件的直径复制率会变好。当采用粒径为约80 / am的UHMW-PE细粉时,随着PCB的微孔直径减小,微柱阵列塑料部件的直径复制率变好。原创性/价值-在本文中,通过一种在腔体中进行超声波塑化和成型的技术成功地制备了具有良好复制性的微柱阵列塑料零件。该技术可以应用于医学,通信,光学,化学等领域,例如生物微针阵列,微生物微芯片,光学存储器和化学反应微芯片。

著录项

  • 来源
    《Circuit World》 |2013年第2期|95-101|共7页
  • 作者单位

    Shenzhen Graduate School, Harbin Institute of Technology, Shenzhen, People's Republic of China;

    Shenzhen Graduate School, Harbin Institute of Technology, Shenzhen, People's Republic of China;

    Shenzhen Key Laboratory of Advanced Manufacturing Technology for Mold&Die, College of Mechatronics and Control Engineering, Shenzhen University, Shenzhen, People's Republic of China;

    Shenzhen Key Laboratory of Advanced Manufacturing Technology for Mold&Die, College of Mechatronics and Control Engineering, Shenzhen University, Shenzhen, People's Republic of China;

    Shenzhen Key Laboratory of Advanced Manufacturing Technology for Mold&Die, College of Mechatronics and Control Engineering, Shenzhen University, Shenzhen, People's Republic of China;

    Shenzhen Key Laboratory of Advanced Manufacturing Technology for Mold&Die, College of Mechatronics and Control Engineering, Shenzhen University, Shenzhen, People's Republic of China;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    materials with purpose; plasticizers; physical properties of materials; mouldability; micro-hole array PCB; micro-molding; ultrasonic vibration; ultra-high molecule weight polyethylene (UHMW-PE);

    机译:有目的的材料;增塑剂;材料的物理性质;可塑性微孔阵列PCB;微成型超声波振动超高分子量聚乙烯(UHMW-PE);
  • 入库时间 2022-08-18 01:17:29

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