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Fabrication of a polymeric tapered HARMs array utilizing a low-cost nickel electroplated mold insert

机译:利用低成本的镍电镀模具插件制造聚合物锥形HARMs阵列

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摘要

A simple low-cost technique has been developed to fabricate a mold insert for replicating polymeric tapered high aspect ratio microstructures. A backside exposure technique is used to first obtain a tapered sidewall structure as an electroplating mold in SU-8 photoresist on a glass wafer. Nickel electroplating is utilized to form the mold insert. The lowest average surface roughness of the nickel mold insert on the side that interfaces with the glass wafer during electroplating is measured to be 7.02 nm. A novel technique involving use of titanium putty is introduced here to reduce cost and effort required to fabricate the mold insert. Replication of tapered microstructures in polymeric materials utilizing the fabricated mold insert is demonstrated here in polydimethylsiloxane by a direct molding process and in polymethyl methacrylate by hot embossing. The fabrication details for the mold insert are described. Advantages and disadvantages of the use of titanium putty for achieving superior metal surface finish are given.
机译:已经开发了一种简单的低成本技术来制造用于复制聚合物锥形高纵横比微结构的模具插件。使用背面曝光技术首先获得锥形侧壁结构,作为玻璃晶片上SU-8光刻胶中的电镀模具。电镀镍用于形成模具嵌件。电镀过程中与玻璃晶片相接触的一侧的镍模具嵌件的最低平均表面粗糙度经测量为7.02 nm。这里介绍一种涉及使用钛腻子的新颖技术,以降低制造模具嵌件所需的成本和工作量。在此,通过直接成型工艺在聚二甲基硅氧烷中以及在通过热压花在聚甲基丙烯酸甲酯中证明了利用制造的模具插件在聚合物材料中复制锥形微结构。描述了模具插件的制造细节。给出了使用钛腻子以获得优异的金属表面光洁度的优缺点。

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  • 来源
    《Microsystem Technologies》 |2007年第4期|287-291|共5页
  • 作者单位

    Integrated Microsystems Group Electronic Material ampamp Device Laboratory Department of Electrical and Computer Engineering Louisiana State University Baton Rouge LA 70803 USA;

    Integrated Microsystems Group Electronic Material ampamp Device Laboratory Department of Electrical and Computer Engineering Louisiana State University Baton Rouge LA 70803 USA;

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