QUALITY CONTROL OF SEMICONDUCTOR PACKAGING BASED ON PRINCIPAL COMPONENTS ANALYSIS

摘要

5 critical quality characteristics must be controlled in the surface mount and wire-bond process in semiconductor packaging. And these characteristics are correlated with each other. So the principal components analysis(PCA) is used in the analysis of the sample data firstly. And then the process is controlled with hotelling T~2 control chart for the first several principal components which contain sufficient information. Furthermore, a software tool is developed for this kind of problems. And with sample data from a surface mounting device(SMD) process, it is demonstrated that the T~2 control chart with PCA gets the same conclusion as without PCA, but the problem is transformed from high-dimensional one to a lower dimensional one, i.e., from 5 to 2 in this demonstration.