首页> 外文期刊>MRS bulletin >Surface Defects and Passivation of Ge and III-V Interfaces
【24h】

Surface Defects and Passivation of Ge and III-V Interfaces

机译:Ge和III-V界面的表面缺陷和钝化

获取原文
获取原文并翻译 | 示例
           

摘要

The need for high-K gate dielectrics and metal gates in advanced integrated circuits has reopened the door to Ge and III-V compounds as potential replacements for silicon channels, offering the possibility to further increase the performances of complementary metal oxide semiconductor (CMOS) circuits, as well as adding new functionalities. Yet, a fundamental issue related to high-mobility channels in CMOS circuits is the electrical passivation of their interfaces (i.e., achieving a low density of interface defects) approaching state-of-the-art Si-based devices. Here we discuss promising approaches for the passivation of Ge and III-v compounds and highlight insights obtained by combining experimental characterization techniques with first-principles simulations.
机译:先进集成电路中对高K栅极电介质和金属栅极的需求重新打开了Ge和III-V化合物作为硅沟道的潜在替代品的大门,从而有可能进一步提高互补金属氧化物半导体(CMOS)电路的性能,以及添加新功能。然而,与CMOS电路中的高迁移率通道有关的基本问题是其接口的电钝化(即,实现接口缺陷的低密度)接近最先进的基于Si的器件。在这里,我们讨论了Ge和III-v化合物钝化的有前途的方法,并强调了通过将实验表征技术与第一性原理模拟相结合而获得的见解。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号