机译:金膜表面纳米银浆的低温烧结
The Laboratory of Printing & Packaging Material and Technology, Beijing Institute of Graphic Communication, Beijing 102600, China;
The Laboratory of Printing & Packaging Material and Technology, Beijing Institute of Graphic Communication, Beijing 102600, China;
The Laboratory of Printing & Packaging Material and Technology, Beijing Institute of Graphic Communication, Beijing 102600, China;
The Laboratory of Printing & Packaging Material and Technology, Beijing Institute of Graphic Communication, Beijing 102600, China;
nanosilver paste; sintering of nano particles; rheological behavior; solid content; low sintering temperature;
机译:金膜表面纳米银浆的低温烧结
机译:低温可烧结纳米银模压贴糊的收缩和烧结行为
机译:压力辅助低温烧结纳米银浆,5次,$ 5-$ {rm mm} ^ {2} $芯片固定
机译:纳米银浆的低温烧结在铜上的芯片键合工艺及性能
机译:用于半导体器件互连的纳米级银浆的低温烧结。
机译:空气中低温烧结在纤维素纸上过滤诱导的导电/稳健铜膜的生产
机译:甲基封端的Si(111)表面上的烧结金纳米粒子膜的近理想光电二极管。