Opportunities in Uncooled Infrared Imaging: A MEMS Perspective

摘要

Infrared imaging spans a wide range of wavelengths, underlying technologies, and applications. Advancements in cost reduction and performance have the potential for opening up new markets, for both military and consumer applications. Micromachining and wafer fabrication technologies are critical for the production of infrared (IR) sensor arrays. This paper investigates ways in which micro-electro-mechanical systems (MEMS) design experience can be applied to uncooled IR imaging in the areas of direct view and multispectral sensor technology.