Pb-Free Solder Paste Offers Quality Mounting of 0402 Chips

摘要

Following the emergence of highly compact mounting boards, improving the quality of high-density mounting has become an industry requirement. This can be met by using smaller components like the 0402-sized or the 01005 parts, or through fillet-less mounting and narrow-pitch mounting.rnWhile these measures are being promoted, the reduction of joint strength becomes an issue because of the extremely small pads and volume of solders, resulting from the narrowed components, and land and fillet-less mounting. The use of a ductile alloy compliant with narrow-pitch mounting of micro components, and an excellent solder paste with stable printing and reflow characteristics, therefore becomes necessary.