METHOD OF MOUNTING SOLDER CHIP, APPARATUS FOR MOUNTING SOLDER CHIP, APPARATUS FOR SUPPLYING SOLDER CHIP, APPARATUS FOR ARRANGING SOLDER CHIPS IN ORDER, SUCTION HEAD, AND CIRCUIT BOARD

摘要

PURPOSE: To reduce orientation time of solder balls on a tray, and improve productivity, by a method wherein, after solder chips are dropped in a plurality of recesses and orientated in a first chamber of an orientation jig, superfluous solder chips are automatically moved to a second chamber via a shutter. ;CONSTITUTION: When solder chips are supplied into an orientation jig 14, a shaking device 16 starts shaking. The solder chips are dropped in recesses 88a of an orientation part member 88 and orientated. When the orientation is finished, a shutter 82 of the orientation jig 14 is opened, and the orientation jig 14 is inclined by an angle . Superfluous solder chips are moved to a second chamber 80b, and the shutter 82 is closed. The solder chips are taken out by a suction head 38 and carried by a robot 36. The shutter 82 of the orientation jig 14 is opened, and the superfluous solder chips accommodated in the second chamber 80b are again introduced in the first chamber 80a and orientation is again performed.;COPYRIGHT: (C)1996,JPO