Laser diode device for use as light source in automotive region, has solder layer arranged between laser diode chip and mounting element, and chip arranged on mounting element, where thickness of solder layer lies within specific range

摘要

The device (100) has a housing (1) provided with a housing portion (10), and a mounting element (11) connected with the portion. A laser diode chip (2) is arranged on the mounting element. A cladding layer, a waveguide layer, an active layer, a semiconductor contact layer, a semiconductor layer are arranged on a substrate. The portion and the mounting element comprise a base body that is made of copper, where the portion is sheathed by steel. A solder layer (3) is arranged between the chip and the mounting element, where a thickness of the solder layer is larger than or equal to 3 micrometer. The housing is designed as a TO-38 type housing, a TO-56 type housing or TO-90 type housing.