SOLDER CHIP MOUNTING DEVICE, METHOD OF MOUNTING SOLDER CHIP, AND CIRCUIT BOARD

摘要

PURPOSE: To mount automatically solder chips on a circuit board and to obtain a solder chip mounting device, whose cost is low also from the viewpoint of cost, by a method wherein a robot is actuated in the two directions along the X-axis and Z-axis which is vertical. ;CONSTITUTION: In an alignment station 12 for aligning solder chips, an inspection station 32 for inspecting a state that the solder chips are suked by a robot 36 and a mounting station 42 for mounting the solder chips on a circuit board 40 are arranged in one row and by transferring the chips by the robot 36 movable in the X-axis direction along this row and the Z-axis direction which is vertical, the chips are automatically mounted. Moreover, as the robot 36 has only to be movable in two directions along the X- and Z-axises, a solder chip mounting device is simplified compared with devices where the robot 36, which is moved in three axial directions, is adopted, and the cost of the device can be lowered.;COPYRIGHT: (C)1996,JPO