New Additive for Copper Plating Fits TSV Filling

摘要

ADEKA CORPORATION has developed a new additive for through silicone via (TSV) copper plating. TSV electrodes can provide vertical electrical connections that pass internally through semiconductor chips. Semiconductor devices are reaching their physical limit with respect to improving performance by miniaturizing line widths. Semiconductor manufacturers are now attempting to achieve smaller size and higher performance of devices by stacking multiple chips into the 3D structure.