Flip Chip Bonder Pursues High-Quality, Low-Cost Production

摘要

Panasonic Factory Solutions Co., Ltd. (PFSC) held Panasonic FA Show 2014 in December in Tokyo, Japan, and showcased the MD-P300 flip chip bonder, which is based on MD-P200US and supports 300mm wafer. The MD-P300 highlighted high-quality and low-cost production. Electronic devices manufacturers must achieve smaller and thinner devices with high quality at low cost, responding to wider mounting area due to the increase in the number of components and IC pins in products. Flip chip (FC) bonder attracts attention as a components mounter that addresses these requirements.