New Solutions Improve Wafer Edge Yield

摘要

At SEMICON Korea 2016, Lasertec Corp. introduces solutions that address the needs of wafer edge yield improvement and illustrates their usages. EZ300 wafer edge inspection system is a new concept that offers the capability to inspect, review and measure wafer edges on a single platform. It revolutionizes the way chip manufacturers take on yield improvement. EZ300 enables automatic defect classification with proprietary software algorithm that processes high contrast images from confocal optics (Fig. 1). This allows users to segregate defects of interest (DOI) at wafer edges in production line - a challenge that has been considered difficult to overcome.