SMIC Levels PCB Soldering With Reflow Oven

摘要

Senju Metal Industry Co., Ltd. (SMIC) has developed a double-chamber reflow oven. The company plans to release the product, SNR-GTW, this fall. A reflow oven is equipment for soldering printed circuit boards (PCBs) where components are surface mounted. Temperature inside the oven is increased to 200 to 300℃ to melt solder in a short time using hot air or infrared ray, which is then cooled to solder. The double-chamber reflow oven developed by SMIC has a structure with two independent chambers arranged inside the oven, differing from the dual system, wherein PCBs are soldered simultaneously on two lanes in a single oven.