Reflow Optimization Process: Thermal Stress Using Numerical Analysis and Intermetallic Spallation in Backwards Compatibility Solder Joints

著录项

• 来源
  《Arabian Journal for Science and Engineering》 |2015年第6期|1669-1679|共11页
• 作者

  F. Che Ani; A. Jalar; R. Ismail; N. K. Othman; M. Z. Abdullah; M. S. Abdul Aziz; C. Y. Khor; M. Abu Bakar;

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• 作者单位

  1.Institute of Microengineering and Nanoelectronics University Kebangsaan Malaysia (The National University of Malaysia) 43600 Bangi Selangor Malaysia;

  1.Institute of Microengineering and Nanoelectronics University Kebangsaan Malaysia (The National University of Malaysia) 43600 Bangi Selangor Malaysia;

  1.Institute of Microengineering and Nanoelectronics University Kebangsaan Malaysia (The National University of Malaysia) 43600 Bangi Selangor Malaysia;

  2.Faculty of Science and Technology School of Applied Physics Universiti Kebangsaan Malaysia (The National University of Malaysia) 43600 Bangi Selangor Malaysia;

  3.School of Mechanical Engineering Universiti Sains Malaysia Engineering Campus 14300 Nibong Tebal Penang Malaysia;

  3.School of Mechanical Engineering Universiti Sains Malaysia Engineering Campus 14300 Nibong Tebal Penang Malaysia;

  3.School of Mechanical Engineering Universiti Sains Malaysia Engineering Campus 14300 Nibong Tebal Penang Malaysia;

  1.Institute of Microengineering and Nanoelectronics University Kebangsaan Malaysia (The National University of Malaysia) 43600 Bangi Selangor Malaysia;

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• 收录信息 美国《科学引文索引》(SCI);
• 原文格式 PDF
• 正文语种 eng
• 中图分类
• 关键词

  Backwards compatibility solder joints; Reflow optimization; Intermetallic spallation; Thermal stress; Numerical analysis;

  机译：向后兼容焊点;回流优化;金属间散裂;热应力;数值分析;
• 入库时间 2022-08-18 02:58:15