机译:表面调制,提高切片碳化硅Si-Face的化学机械抛光性能
Tsinghua Univ State Key Lab Tribol Beijing 10084 Peoples R China|Guangdong Prov Key Lab Optomechatron Shenzhen 518057 Peoples R China|Tsinghua Univ Shenzhen Shenzhen Key Lab Micro Nano Mfg Res Inst Shenzhen 518057 Peoples R China;
Guangdong Univ Technol Sch Electromech Engn Laser Micro Nano Proc Lab Guangzhou 510006 Peoples R China;
Guangdong Univ Technol Sch Electromech Engn Laser Micro Nano Proc Lab Guangzhou 510006 Peoples R China;
Tsinghua Univ State Key Lab Tribol Beijing 10084 Peoples R China|Guangdong Prov Key Lab Optomechatron Shenzhen 518057 Peoples R China;
Tsinghua Univ State Key Lab Tribol Beijing 10084 Peoples R China|Guangdong Prov Key Lab Optomechatron Shenzhen 518057 Peoples R China;
Guangdong Univ Technol Sch Electromech Engn Laser Micro Nano Proc Lab Guangzhou 510006 Peoples R China;
Tsinghua Univ State Key Lab Tribol Beijing 10084 Peoples R China|Guangdong Prov Key Lab Optomechatron Shenzhen 518057 Peoples R China|Tsinghua Univ Shenzhen Shenzhen Key Lab Micro Nano Mfg Res Inst Shenzhen 518057 Peoples R China;
SiC; Surface modulation; Nanosecond laser; CMP;
机译:轴向Si面6H-SiC晶片的化学机械抛光(CMP),以获得原子平坦的无缺陷表面
机译:胶合碳化物刀片最终表面化学机械抛光的实验研究,用于有效切削奥氏体不锈钢
机译:新型聚苯乙烯/ CeO_2-TiO_2多组分核/壳磨料,用于反应结合碳化硅的高效,高质量的光催化辅助化学机械抛光
机译:碳化硅和氮化硅沉淀物在化学机械抛光的MC-硅晶片上的映射
机译:混合表面活性剂系统可控制恶劣环境中的分散稳定性,以增强金属表面的化学机械抛光(CMP)。
机译:化学机械抛光实施后化学机械抛光对钛植入物表面性质的影响FT-IR和钛植入物表面的润湿性数据
机译:焊盘表面粗糙对大直径硅晶片化学机械抛光中施加到GaN基LED衬底的影响
机译:碳化硅的化学机械抛光