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Predicting the Material Removal Rate (MRR) in surface Magnetorheological Finishing (MRF) based on the synergistic effect of pressure and shear stress

机译:基于压力和剪切应力的协同效应,预测表面磁流变精加工(MRF)中的材料去除率(MRR)

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摘要

Although the pressure and shear stress are motivations of the material removal of optical component surface in magnetorheological finishing, pressure is often ignored as the shear stress is the dominant factor in the removal rate prediction. To develop a more precise prediction removal function model, the role of pressure should be considered. Herein, a material removal rate (MRR) model involving the pressure and shear stress is proposed. Experiments were carried out to verify the validity of the MRR model under various process parameters, including the immersion depth, viscosity of magnetorheological fluid, and rotational speed of the polishing wheel. The pressure is shown to be indispensable in predicting the peak and volumetric removal rate. In addition, the MRR model including pressure allows for a better agreement of the removal function topography in comparison with the only shear stress-induced material removal model. This work fills in gaps relating to fundamental MRF mechanisms and provides a new perspective for the study of material removal behaviors of MRF on optics.
机译:尽管在磁流变精加工中压力和剪切应力是光学部件表面材料去除的动机,但由于剪切应力是预测去除速率的主要因素,因此压力常常被忽略。要开发更精确的预测去除函数模型,应考虑压力的作用。在此,提出了一种涉及压力和剪切应力的材料去除率(MRR)模型。进行了实验以验证MRR模型在各种工艺参数(包括浸入深度,磁流变液的粘度和抛光轮的转速)下的有效性。在预测峰值和体积去除率时,压力是必不可少的。另外,与唯一的剪切应力诱导的材料去除模型相比,包括压力的MRR模型可以使去除函数的形貌更好地吻合。这项工作填补了与基本MRF机制有关的空白,并为研究光学MRF的材料去除行为提供了新的视角。

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