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The fabrication of a high-sensitivity surface-enhanced Raman spectra substrate using texturization and electroplating technology

机译:使用纹理化和电镀技术制造高灵敏度表面增强拉曼光谱基板

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摘要

A method for preparing surface-enhanced Raman scattering substrate with high sensitivity is presented in this study. The new type of substrate was fabricated by depositing silver nanoparticles, using electroplating, onto the surface of boron-doped single silicon with a texture of inverted pyramid arrays prepared by the technology of texturization. In order to evaluate the enhancement ability of the substrate, a test of Raman scattering with Rhodamine 6G (R6G) as probe molecules was performed and the results showed a high sensitivity, good uniformity and stability. Relay on the enhancement by the substrate, the Raman scattering signal of R6G with a high signal-to-noise ratio could be detected out at a rather low concentration level of 10(-18) M. The performance of the substrate is also simulated and illustrated using the software COMSOL Multiphysics. The electric field is greatly enhanced on the surface of silicon wafer with inverted pyramid morphology, especially in pits. According to the electromagnetic enhancement theory, the calculated Raman enhancement factor is as high as 10(11), which strongly supports the experimental data. This work may offer a novel and practical method for Raman spectroscopy application in trace analysis.
机译:本研究提出了一种高灵敏度的表面增强拉曼散射基底的制备方法。通过电镀将银纳米颗粒沉积到掺杂硼的单硅表面上来制备新型衬底,该硼掺杂的单硅表面具有通过纹理化技术制备的倒金字塔结构。为了评估基材的增强能力,进行了以罗丹明6G(R6G)作为探针分子的拉曼散射测试,结果显示出高灵敏度,良好的均匀性和稳定性。依靠底物的增强,可以在10(-18)M的较低浓度下检测出具有高信噪比的R6G的拉曼散射信号。还对底物的性能进行了模拟和使用COMSOL Multiphysics软件进行说明。具有倒金字塔形状的硅晶片表面的电场大大增强,尤其是在凹坑中。根据电磁增强理论,计算得出的拉曼增强因子高达10(11),有力地支持了实验数据。这项工作可能为拉曼光谱在痕量分析中的应用提供一种新颖实用的方法。

著录项

  • 来源
    《Applied Surface Science》 |2019年第1期|109-116|共8页
  • 作者单位

    Shanghai Univ, Inst Biomed Engn, Sch Commun & Informat Engn,Key Lab Specialty Fibe, Shanghai Inst Adv Commun & Data Sci,Joint Int Res, 333 Nanchen Rd, Shanghai 200444, Peoples R China;

    Shanghai Univ, Inst Biomed Engn, Sch Commun & Informat Engn,Key Lab Specialty Fibe, Shanghai Inst Adv Commun & Data Sci,Joint Int Res, 333 Nanchen Rd, Shanghai 200444, Peoples R China;

    Shanghai Univ, Inst Biomed Engn, Sch Commun & Informat Engn,Key Lab Specialty Fibe, Shanghai Inst Adv Commun & Data Sci,Joint Int Res, 333 Nanchen Rd, Shanghai 200444, Peoples R China;

    Shanghai Univ, Inst Biomed Engn, Sch Commun & Informat Engn,Key Lab Specialty Fibe, Shanghai Inst Adv Commun & Data Sci,Joint Int Res, 333 Nanchen Rd, Shanghai 200444, Peoples R China;

    Shanghai Univ Med & Hlth Sci, Coll Med Instruments, Shanghai 201318, Peoples R China;

    Shanghai Univ, Inst Biomed Engn, Sch Commun & Informat Engn,Key Lab Specialty Fibe, Shanghai Inst Adv Commun & Data Sci,Joint Int Res, 333 Nanchen Rd, Shanghai 200444, Peoples R China;

    Shanghai Univ, Inst Biomed Engn, Sch Commun & Informat Engn,Key Lab Specialty Fibe, Shanghai Inst Adv Commun & Data Sci,Joint Int Res, 333 Nanchen Rd, Shanghai 200444, Peoples R China;

    Shanghai Univ, Inst Biomed Engn, Sch Commun & Informat Engn,Key Lab Specialty Fibe, Shanghai Inst Adv Commun & Data Sci,Joint Int Res, 333 Nanchen Rd, Shanghai 200444, Peoples R China;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    SERS; Substrate; Texturization; Electroplating; Inverted pyramid arrays;

    机译:SERS;基底;纹理化;电镀;倒金字塔阵列;

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