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The effect of applied negative bias voltage on the structure of Ti-doped a-C : H films deposited by FCVA

机译:施加负偏压对FCVA沉积Ti掺杂a-C:H薄膜结构的影响

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Ti-doped hydrogenated diamond-like carbon (DLC) films were deposited on Si(I 0 0) substrates by a filtered cathodic vacuum arc (FCVA) method using Ar and CH4 as the feedstock. The composition and microstructure of the films were investigated by Raman spectroscopy, X-ray photoelectron spectroscopy and IR spectroscopy. The internal stress was determined by the radius of curvature technique. The influence of the bias voltage on the microstructure of the as-deposited films was investigated. It was found that the graphite-like bonds was dominated in the Ti-doped 3 DLC film deposited at 0 V bias voltage. When bias voltage was increased to - 150 V, more diamond-like bond were produced and the Sp content in film reached the maximum value, after which it decreased and more graphite-like bonds feature produced with further increase of the negative bias voltage. The compressive internal in the Ti-doped DLC films also exhibited a maximum value at - 150 V bias voltage. IR results indicated that C-H bonded intensity reduced, and H atoms bonded with C atoms were substituted for the Ti atoms as the negative bias voltage increasing. All the composition and microstructure change can be explained by considering the plasma conditions and the effect of negative bias voltage applied to the substrate. (c) 2006 Elsevier B.V. All rights reserved.
机译:使用Ar和CH4作为原料,通过过滤阴极真空电弧(FCVA)方法将掺Ti的氢化类金刚石碳(DLC)薄膜沉积在Si(I 0 0)衬底上。通过拉曼光谱,X射线光电子能谱和红外光谱研究了膜的组成和微观结构。内应力由曲率半径技术确定。研究了偏置电压对沉积薄膜微观结构的影响。发现在0V偏置电压下沉积的Ti掺杂的3 DLC膜中,类石墨键占主导。当偏置电压增加到-150 V时,产生了更多的类金刚石键,膜中的Sp含量达到最大值,然后降低,随着负偏置电压的进一步增加,出现了更多的类石墨键。掺钛的DLC膜中的压缩内部也表现出在-150 V偏置电压下的最大值。红外结果表明,随着负偏压的增加,C-H键强度降低,与C原子键合的H原子取代Ti原子。所有组成和微观结构的变化都可以通过考虑等离子体条件和施加到基板上的负偏压的影响来解释。 (c)2006 Elsevier B.V.保留所有权利。

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