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Young's Modulus Of Silicon Nanoplates At Finite Temperature

机译:有限温度下硅纳米板的杨氏模量

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Based on the Keating model, a semi-continuum approach is developed in which the strain energy of silicon nanoplates is presented. Using the quasiharmonic approximation, the temperature dependence of the lattice parameter of silicon has been coupled into the semi-continuum approach. By considering (2 × 1) surface reconstruction of the silicon nanoplate, Young's moduli at finite temperature are modeled and the surface effects on the mechanical properties of the silicon nanoplate are predicted. As the nanoplate thickness is scaled down to 100 nm, Young's moduli begin to deviate from that of the bulk silicon. It is interesting to note that Young's moduli exhibits opposite behavior with and without surface reconstruction. Without surface reconstruction, Young's modulus of the nanoplate decreases dramatically as the nanoplate is scaled down to several tens of nanometer, which means that the nanoplate is elastically softer than bulk. The surface reconstruction leads to stronger bonds and hence an increase in the Young's modulus of the material as it is scaled down, which makes the nanoplate stiffer along the [10 0] direction. Young's modulus of the nanoplate exhibits a negative temperature coefficient.
机译:基于Keating模型,开发了一种半连续方法,其中介绍了硅纳米板的应变能。使用准谐波近似,将硅晶格参数的温度依赖性耦合到半连续方法中。通过考虑硅纳米板的(2×1)表面重构,对有限温度下的杨氏模量进行建模,并预测表面对硅纳米板力学性能的影响。随着纳米板厚度缩小到100 nm,杨氏模量开始偏离体硅的模量。有趣的是,在有和没有表面重构的情况下,杨氏模量表现出相反的行为。如果不进行表面重建,则随着纳米板的尺寸缩小到几十纳米,纳米板的杨氏模量会急剧下降,这意味着纳米板的弹性比体积大。表面重建会导致更牢固的键合,并因此在按比例缩小材料时提高其杨氏模量,从而使纳米板沿[10 0]方向变硬。纳米板的杨氏模量表现出负温度系数。

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