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Growth, coalescence, and electrical resistivity of thin Pt films grown by dc magnetron sputtering on SiO_2

机译:直流磁控溅射在SiO_2上生长的Pt薄膜的生长,聚结和电阻率

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Ultra thin platinum films were grown by dc magnetron sputtering on thermally oxidized Si (100) substrates. The electrical resistance of the films was monitored in situ during growth. The coalescence thickness was determined for various growth temperatures and found to increase from 1.1 nm for films grown at room temperature to 3.3 nm for films grown at 400 ℃. A continuous film was formed at a thickness of 2.9 nm at room temperature and 7.5 nm at 400 ℃. The room temperature electrical resistivity decreases with increased growth temperature, while the in-plain grain size and the surface roughness, measured with a scanning tunneling microscope (STM), increase. Furthermore, the temperature dependence of the film electrical resistance was explored at various stages during growth.
机译:通过直流磁控溅射在热氧化的Si(100)衬底上生长超薄铂膜。在生长过程中就地监测薄膜的电阻。确定了各种生长温度下的聚结厚度,发现聚结厚度从室温下生长的薄膜的1.1 nm增加到400℃下生长的薄膜的3.3 nm。在室温下形成厚度为2.9nm的连续膜,在400℃下形成厚度为7.5nm的连续膜。室温电阻率随生长温度的升高而降低,而用扫描隧道显微镜(STM)测量的平整晶粒度和表面粗糙度则升高。此外,在生长期间的各个阶段都研究了膜电阻的温度依赖性。

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