机译:通过分子动力学模拟研究机加工引起的表面损伤对单晶硅的影响
College of Mechanical Science and Engineering, Jilin University, 5988 Renmin Street, Changchun, film 130025, China;
College of Mechanical Science and Engineering, Jilin University, 5988 Renmin Street, Changchun, film 130025, China;
College of Mechanical Science and Engineering, Jilin University, 5988 Renmin Street, Changchun, film 130025, China;
College of Mechanical Science and Engineering, Jilin University, 5988 Renmin Street, Changchun, film 130025, China;
College of Mechanical Science and Engineering, Jilin University, 5988 Renmin Street, Changchun, film 130025, China;
College of Mechanical Science and Engineering, Jilin University, 5988 Renmin Street, Changchun, film 130025, China;
molecular dynamics; nano-cutting; nanoindentation; machining-induced phase transform; silicon;
机译:通过分子动力学模拟比较传统纳米加工和激光辅助纳米加工对单晶硅的表面损伤
机译:相对刀具清晰度对单晶硅纳米切割地下损伤和材料恢复的影响:分子动力学方法
机译:基于分子动力学模拟的研磨速度对单晶硅地下损伤的影响
机译:硅晶片纳米磨削过程中地下损伤层的分子动力学模拟
机译:陶瓷旋转超声加工的表面和地下损伤:实验研究的分子动力学方法
机译:基于位错动力学的钛合金正交切削亚表面损伤微观组织建模与仿真
机译:叠层研磨晶体取向对单晶硅地下损伤的影响