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C-axis orientation and piezoelectric coefficients of AlN thin films sputter-deposited on titanium bottom electrodes

机译:钛底电极上溅射沉积的AlN薄膜的C轴取向和压电系数

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摘要

Aluminum nitride (AlN) reactively sputter deposited from an aluminum target is an interesting compound material due to its CMOS compatible fabrication process and its piezoelectric properties. To obtain high piezoelectric coefficients it is a necessary pre-request to synthesize films with c-axis orientation. Besides the influence of sputter conditions on the microstructure of A1N thin films the condition of the substrate surface is another important factor of utmost importance. In this study, the influence of 350 nm thick titanium metallization DC sputter-deposited on SiCh/Si substrates at varying back pressure levels b_(p,Ti) in the range of 2 × 10~(-3) to 14 × 10~(-3) mbar on the c-axis orientation and the piezoelectric coefficients of 600 nm thick A1N thin films is investigated. Besides the plasma power for Ti deposition (P_(p,Ti) = 100 W) the parameters for A1N synthetization are fixed to P_p = 1000 W and &_(p,AlN) = 4 × 10~(-3) mbar in 100% N_2 atmosphere. Basically, the surface roughness of the Ti bottom layer is the dominating factor resulting either in a high degree of c-axis orientation (i.e. at low b_(p,Ti) values) or in an amorphous AlN microstructure (i.e. at high b_(p,Ti) values). Under low pressure conditions, a smooth and dense surface characteristics is achieved due to a higher kinetic energy associated with the adatoms what is especially important at nominally unheated substrate conditions. The piezoelectric coefficient d_(33) decreases from 2.55 to 1.7 pm~(-1) when increasing the titanium sputter pressure from 2 × 10~(-3) to 14 × 10~(-3) mbar. When decreasing the Ti film thickness to 60 nm and hence, reducing the root mean square roughness by a factor of about 2, the intensity associated with the AlN (0 0 2) peak is increased by a factor of about 1.7 demonstrating the direct impact. Furthermore, the highest values for d_(33) and d_(31) (i.e. 3.15pmV~(-1) and -1.28pmV~(-1)) are determined.
机译:从铝靶进行反应性溅射沉积的氮化铝(AlN)是一种有趣的复合材料,因为它具有CMOS兼容的制造工艺和压电特性。为了获得高压电系数,必须预先要求合成具有c轴取向的薄膜。除了溅射条件对AlN薄膜的微观结构的影响之外,衬底表面的条件是另一个至关重要的重要因素。在这项研究中,在2×10〜(-3)至14×10〜(范围内)的不同背压水平b_(p,Ti)下,溅射沉积在SiCh / Si衬底上的350 nm厚钛金属化DC的影响。 -3)研究c轴上的mbar和厚度为600 nm的AlN薄膜的压电系数。除了用于Ti沉积的等离子功率(P_(p,Ti)= 100 W)之外,用于AlN合成的参数还固定为P_p = 1000 W和&_(p,AlN)= 4×10〜(-3)mbar(100%) N_2气氛。基本上,Ti底层的表面粗糙度是导致高c轴取向(即,在低b_(p,Ti)值时)或非晶AlN微观结构(即在高b_(p ,Ti)值)。在低压条件下,由于与吸附原子相关的较高动能而获得了光滑而致密的表面特性,这在标称未加热的基材条件下尤为重要。当钛溅射压力从2×10〜(-3)增至14×10〜(-3)mbar时,压电系数d_(33)从2.55降低至1.7 pm〜(-1)。当将Ti膜厚度减小到60 nm并因此将均方根粗糙度减小大约2倍时,与AlN(0 0 2)峰相关的强度将增加大约1.7倍,这表明了直接冲击。此外,确定d_(33)和d_(31)的最大值(即3.15pmV〜(-1)和-1.28pmV〜(-1))。

著录项

  • 来源
    《Applied Surface Science》 |2012年第2012期|59-65|共7页
  • 作者单位

    Hijjawi Faculty for Engineering Technology, Department of Electronics Engineering, Yarmouk University, Irbid, Jordan;

    Hijjawi Faculty for Engineering Technology, Department of Electronics Engineering, Yarmouk University, Irbid, Jordan;

    Department of Mechatronics, Saarland University, D-66123 Saarbruecken, Germany;

    Departamento Ingenieria Electrica, Electronica, Automatica y Comunicaciones, E.T.S.I, Industriales, Universidad de Castilla-La Mancha, 13071 Ciudad Real, Spain;

    Departamento Ingenieria Electrica, Electronica, Automatica y Comunicaciones, E.T.S.I, Industriales, Universidad de Castilla-La Mancha, 13071 Ciudad Real, Spain;

    Departamento Ingenieria Electrica, Electronica, Automatica y Comunicaciones, E.T.S.I, Industriales, Universidad de Castilla-La Mancha, 13071 Ciudad Real, Spain;

    Department of Microsystems Technology, Vienna University of Technology, Floragasse 7, 1040 Vienna, Austria;

    Department of Microsystems Technology, Vienna University of Technology, Floragasse 7, 1040 Vienna, Austria;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    aluminum nitride; metal electrode; thin film; sputter deposition technique; XRD analyses; c-axis orientation; surface roughness; piezoelectric coefficients; laser vibrometry;

    机译:氮化铝金属电极薄膜;溅射沉积技术XRD分析;c轴方向;表面粗糙度;压电系数激光振动计;

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