The effect of surfactants on the electropolishing behavior of copper in orthophosphoric acid

摘要

The electropolishing behavior of copper was studied in orthophosphoric acid with Triton X-100, sodium dodecyl sulphate and cetyl pyridinium chloride as additives for improving the finish obtained on copper surface. This was investigated by measuring and comparing anode potential-limiting current relationships in solutions of gradually increasing concentration of surfactants. The addition of surfactants to the electropolishing solution results in a lower limiting current. This confirms the mass transport of dissolved species from the anode surface to the bulk of solution as the rate-determining step in the presence of three surfactants in all concentrations investigated. Scanning electron microscope (SEM), atomic force microscope (AFM) and measured brightness values were used to investigate the copper surface after electropolishing and the results were compared to polishing done in absence of surfactants. According to SEM images and brightness values, addition of Triton X-100 was effective to enhance levelling and brightening more than sodium dodecyl sulphate and cetyl pyridinium chloride. AFM analysis showed that the roughness values (R_a) for an electropolished copper surface, in presence of surfactants, is significantly lower than in absence of surfactants. Different reaction conditions and the physical properties of solutions are studied to obtain dimensionless correlation among all these parameters.