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Atomic scale calculations of tungsten surface binding energy and beryllium-induced tungsten sputtering

机译:钨表面结合能和铍诱导钨溅射的原子尺度计算

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摘要

Tungsten surface binding energy is calculated using classical molecular dynamic simulations with three many-body potentials. We present the consistency in tungsten sputtering yield by beryllium bombardment between molecular dynamic LAMMPS code and binary collision approximation ITMC code using the new surface binding energy (11.75 eV). The commonly used heat of sublimation value (8.68 eV) could lead to overestimated sputtering yield results. The analysis of the sputtered tungsten angular distributions show that molecular dynamic accurately reproduced the [111] most prominent preferential ejection directions in bcc tungsten, while the distinct shapes by typical MC codes such as ITMC code is caused by the treatment of amorphous target. The ITMC calculated emitted tungsten energy profile matches the Thompson energy spectrum, while the molecular dynamic results generally follow the Falcone energy spectrum.
机译:使用具有三个多体势的经典分子动力学模拟计算钨的表面结合能。我们介绍了使用新的表面结合能(11.75 eV)进行的分子动力学LAMMPS代码和二元碰撞近似ITMC代码之间的铍轰击,在钨溅射产量中的一致性。常用的升华值热量(8.68 eV)可能导致高估溅射产量的结果。溅射钨角分布的分析表明,分子动力学准确地再现了bcc钨中最显着的[111]优先喷射方向,而典型的MC代码(如ITMC代码)的不同形状是由非晶靶的处理引起的。 ITMC计算的发射钨能谱与Thompson能谱匹配,而分子动力学结果通常遵循Falcone能谱。

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