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Electrical characterization of FIB processed metal layers for reliable conductive-AFM on ZnO microstructures

机译:FIB处理的金属层的电学特性,用于在ZnO微结构上可靠地进行导电AFM

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We report on the conductive-atomic force microscopy (C-AFM) study of metallic layers in order to find the most suitable configuration for electrical characterization of individual ZnO micro-pillars fabricated by focused ion beam (FIB). The electrical resistance between the probe tip and both as deposited and FIB processed metal layers (namely, Cr, Ti, Au and Al) has been investigated. Both chromium and titanium evidenced a non homogenous and non ohmic behaviour, non negligible scanning probe induced anodic oxidation associated to electrical measurements, and after FIB milling they exhibited significantly higher tip-sample resistance. Aluminium had generally a more apparent non conductive behaviour. Conversely, gold films showed very good tip-sample conduction properties being less sensitive to FIB processing than the other investigated metals. We found that a reliable C-AFM electrical characterization of ZnO microstructures obtained by FIB machining is feasible by using a combination of metal films as top contact layer. An Au/Ti bilayer on top of ZnO was capable to sustain the FIB fabrication process and to form a suitable ohmic contact to the semiconductor, allowing for reliable C-AFM measurement. To validate the consistency of this approach, we measured the resistance of ZnO micropillars finding a linear dependence on the pillar height, as expected for an ohmic conductor, and evaluated the resistivity of the material. This procedure has the potential to be downscaled to nanometer size structures by a proper choice of metal films type and thickness. (C) 2016 Elsevier B.V. All rights reserved.
机译:我们报告金属层的导电-原子力显微镜(C-AFM)研究,以便找到最合适的配置,以通过聚焦离子束(FIB)制作单个ZnO微柱的电特性。已经研究了探针尖端与沉积和FIB处理的金属层(即Cr,Ti,Au和Al)之间的电阻。铬和钛均表现出与电测量相关的非均质和非欧姆行为,不可忽略的扫描探针诱发的阳极氧化,在FIB研磨后,它们表现出明显更高的尖端样品电阻。铝通常具有更明显的不导电行为。相反,金膜显示出非常好的尖端样品导电性能,其对FIB处理的敏感性低于其他研究金属。我们发现,通过结合使用金属膜作为顶部接触层,通过FIB加工获得的ZnO微结构的可靠C-AFM电表征是可行的。 ZnO顶部的Au / Ti双层能够维持FIB的制造过程并与半导体形成合适的欧姆接触,从而实现可靠的C-AFM测量。为了验证此方法的一致性,我们测量了ZnO微柱的电阻,发现其与柱高成线性关系,这是对欧姆导体的预期,并评估了材料的电阻率。通过适当选择金属膜的类型和厚度,该方法有可能缩小为纳米尺寸的结构。 (C)2016 Elsevier B.V.保留所有权利。

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