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Preparation of YBCO thin film by MOCVD method using new liquidmetal organic precursors

机译:新型液态金属有机前体的MOCVD法制备YBCO薄膜

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New low melting point yttrium, barium, and copper complexes were synthesized for metalorganic chemical vapor deposition (MOCVD), tris(2,2,6,6-tetramethyl-3,5-octandionato)yttrium (Y(TMOD)3), Ba(TMOD)2, and bis(6-ethyl-2,2-dimethyl-3,5-octanedionato)copper (Cu(EDMOD)2). The melting point of Y(TMOD)3, 95°C, is 80°C lower than that of the conventional tris(dipivalaylmethanato)yttrium (Y(DPM)3). The melting point of Cu(EDMOD)2 is 78°C, which is 120°C lower than that of Cu(DPM)2. For fabrication of YBa2Cu3Oy-δ thin films, these complexes were used in the liquid state where a stable deposition rate could be obtained; the Y(TMOD)3 and the Cu(EDMOD)2 were heated at 105°C and 90°C, respectively, and the mixture of Ba(DPM)2 and Ba(TIMOD)2 in the ratio of 4 to 1 was used at 215°C. Single crystal STO(100) was used as a substrate. Substrate temperature was 800°C. Thin films, of thickness 200 nm, were obtained. The XRD patterns of all the samples showed the preferred orientation of the c-axis normal to the substrate surface. The superconductivity was confirmed at 78 K
机译:合成了用于金属有机化学气相沉积(MOCVD),三(2,2,6,6-四甲基-3,5-辛二酮基)钇(Y(TMOD)3),钡的新型低熔点钇,钡和铜配合物(TMOD)2和双(6-乙基-2,2-二甲基-3,5-辛二酮)铜(Cu(EDMOD)2)。 Y(TMOD)3的熔点为95°C,比常规的三(二戊基甲酰氨基)钇(Y(DPM)3)的熔点低80°C。 Cu(EDMOD)2的熔点为78℃,比Cu(DPM)2的熔点低120℃。在制备YBa2Cu3Oy-δ薄膜时,这些配合物以液态获得了稳定的沉积速率。将Y(TMOD)3和Cu(EDMOD)2分别在105°C和90°C加热,并使用比例为4:1的Ba(DPM)2和Ba(TIMOD)2的混合物在215°C下。单晶STO(100)被用作衬底。基板温度为800℃。获得厚度为200nm的薄膜。所有样品的XRD图谱均显示了垂直于基材表面的c轴的首选方向。在78 K时确认超导性

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