Fabrication of Nb/Al-Nx/NbTiN junctions for SIS mixerapplications

摘要

We discuss fabrication and characteristics of superconductor-insulator-superconductor (SIS) junctions which typically exhibit a 3.5 mV sum-gap voltage. Junctions have a sub-gap to normal state resistance ratio of RSG/RN=27 for resistance-area products down to RNA=8 Ω μm2 and high quality junctions have been produced with RNA products as low as 4 Ω μm2. The device structure incorporates a Nb base electrode, a tunnel barrier formed by plasma nitridation of a thin Al proximity layer, and a NbTiN counter-electrode. Results for all Nb junctions with high current density aluminum-nitride barriers are also shown. Nitridation of the aluminum layer is investigated by control of the dc floating potential on a separate rf driven electrode in the vacuum process chamber. Devices are integrated to a mixer antenna structure incorporating NbTiN as a ground plane. The wire circuit layer can be either normal metal or NbTiN. Annealing results show improved I-V characteristics with increased RNA products. Recent receiver measurements employing these junctions exhibit low noise performance up to 900 GHz