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Microstructure and electrical properties of BSCCO tapes withceramic barriers

机译:具有陶瓷阻挡层的BSCCO胶带的微观结构和电性能

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The AC-losses in multifilamentary tapes can be reduced mainly by insulating barriers and/or by twisting. We prepared multifilamentary Bi-2223/Ag tapes with the PIT process using monofilaments dip-coated with a ceramic barrier (BaZrO3, YSZ, CeO2). All tapes with ceramic barriers showed, besides lower losses, a degradation of the critical current density due to interactions between the barrier material and the BSCCO-filaments during heat treatment. Furthermore, we studied the influence of the twist pitch on the AC-losses and the critical current density of twisted tapes without barriers. Microstructural investigations showed a partial damaging of the inner filaments during flat rolling
机译:复丝带中的交流电损耗主要可通过绝缘屏障和/或扭曲来降低。我们使用浸涂有陶瓷阻隔层(BaZrO3,YSZ,CeO2)的单丝通过PIT工艺制备了多丝Bi-2223 / Ag胶带。除具有较低的损耗外,所有带有陶瓷阻隔层的胶带均显示出由于在热处理过程中阻隔层材料与BSCCO细丝之间的相互作用而导致的临界电流密度的降低。此外,我们研究了扭曲间距对交流损耗和无障碍扭曲带临界电流密度的影响。显微组织研究表明,扁钢轧制时内部细丝部分损坏

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