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Effects of Ni Sheath on the Microstructure and Properties of BSCCO-2223 Tapes

机译:Ni护套对BSCCO-2223胶带微观结构和性质的影响

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Effects of Ni sheath on the microstructure, mechanical properties and bubbling phenomenon during heating process of BSCCO-2223 ceramic tapes have been investigated. Ni sheath gives Bi-2223 tapes a better ability to protect ceramic core from the damage of external force. Hardness of Ni sheath is double than that of Ag sheath reached to about 70 HV. Tensile strength of the Ni-sheathed Bi-2223 tapes is also enhanced by 80%. Harder Ni sheath is also beneficial to improve the texture of the tapes. However, serious bubbling phenomenon, which can reduce the transport property of tapes, will appear during heating process owing to the bad oxygen permeability of Ni. A lower heating rate (30°C /h) is a favorite to decrease the number and size of bubbles. In addition, Ni sheath can reduce the formation rate of Bi-2223 phase which implies that longer sintering time and higher cost of fabrication will be consumed.
机译:研究了Ni护套对BSCCO-2223陶瓷胶带加热过程中的微观结构,机械性能和鼓泡现象的影响。 Ni Sheath为Bi-2223提供了更好的能力,可以保护陶瓷芯免受外力损坏。 Ni护套的硬度比Ag护套达到约70hv的硬度。 Ni-Sheathed Bi-2223带的拉伸强度也增强了80%。更难的Ni护套也有利于改善胶带的质地。然而,由于Ni的缺氧性不良,在加热过程中,可能会出现严重的冒泡现象。由于Ni的透氧不良,将出现在加热过程中出现的胶带的运输性能。较低的加热速率(30°C / h)是最喜欢的,以减少气泡的数量和尺寸。另外,Ni Sheath可以降低Bi-2223相的形成速率,这意味着将消耗更长的烧结时间和更高的制造成本。

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