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Microstructure and J/sub c/ improvements in overpressure processed Ag-sheathed Bi-2223 tapes

机译:超压处理过的Ag护套Bi-2223胶带的微观结构和J / sub c /改进

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Overpressure (OP) processing influences the microstructure and critical current density (J/sub c/) of Ag sheathed Bi-2223 tapes. SEM and mass density measurements show higher core density and fewer micro-cracks in OP tape than in 1 atm tape. The self-field critical current density, J/sub c/ (0 T, 77 K) in multifilamentary tapes was increased from 33.5 kA/cm/sup 2/ with 1 atm processing (1 atm IR) to 48 kA/cm/sup 2/ with OP processing (OP pressure = 148 atm) after the first heat treatment (OP HT1), and to 58.7 kA/cm/sup 2/ with OP processing after intermediate rolling (OP IR). The corresponding values for J/sub c/ (0.1 T, 77 K) are 12.3 kA/cm/sup 2/ (1 atm IR) to 18.2 kA/cm/sup 2/ for OP HT1 and to 22.4 kA/cm/sup 2/ for OP IR.
机译:过压(OP)处理会影响Ag包覆的Bi-2223胶带的微观结构和临界电流密度(J / sub c /)。 SEM和质量密度测量显示,与1 atm胶带相比,OP胶带的芯密度更高,微裂纹更少。复丝带中的自电场临界电流密度J / sub c /(0 T,77 K)从1个atm处理(1 atm IR)的33.5 kA / cm / sup 2 /增加到48 kA / cm / sup 2 /在第一次热处理后进行OP处理(OP压力= 148 atm)(OP HT1),中间轧制后进行OP处理(OP IR)达到58.7 kA / cm / sup 2 /。 J / sub c /(0.1 T,77 K)的相应值为12.3 kA / cm / sup 2 /(1 atm IR)至OP HT1的18.2 kA / cm / sup 2 /和22.4 kA / cm / sup 2 /用于OP IR。

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