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Controlled synthesis, morphological, optical and electrical properties of copper-doped zinc oxysulfide nanostructures

机译:掺杂铜的氧硫化锌纳米结构的受控合成,形态,光学和电学性质

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摘要

Zinc oxysulfide nanostructures may have physical and chemical properties that are different from ZnS or ZnO. Therefore, Cu-doped oxysulfide nanostructures were prepared by vapor transport and their properties were characterized by various techniques. EDAX analysis confirmed the presence of Zn, S, O and Cu in the samples. XRD revealed the formation of mixed phases of hexagonal ZnS, orthorhombic ZnSO~(4), and hexagonal ZnO that is dependent on Cu content. The undoped sample has nanowire morphology. The increase in Cu doping changed the morphology form NWs to a mixture of NWs and nanoparticles (NPs), and then to NPs. The undoped oxysulfide sample has band gap of 4.08 eV, and the band gap decreased to 3.57 eV at 5% Cu doping. The PL intensity was enhanced upon Cu doping with 5 and 10 at% Cu while it weakened at higher Cu contents. The electrical resistivity decreased with Cu content and a thermally activated semiconducting behavior was reported for all samples.
机译:氧硫化锌纳米结构可能具有与ZnS或ZnO不同的物理和化学性质。因此,通过气相传输制备了Cu掺杂的氧硫化物纳米结构,并通过各种技术对其性能进行了表征。 EDAX分析证实了样品中存在Zn,S,O和Cu。 X射线衍射揭示了六方晶状的ZnS,正交晶的ZnSO〜(4)和六方晶状的ZnO的混合相的形成。未掺杂的样品具有纳米线形态。 Cu掺杂的增加将形态从NW变为NW和纳米颗粒(NP)的混合物,然后变为NP。未掺杂的氧硫化物样品的带隙为4.08 eV,在5%的Cu掺杂下,带隙降至3.57 eV。铜掺杂5和10at%的铜后,PL强度增强,而当铜含量较高时,PL强度减弱。电阻率随Cu含量的降低而降低,据报道,所有样品的热活化半导体行为均如此。

著录项

  • 来源
    《Applied Physics 》 |2018年第9期| 617.1-617.8| 共8页
  • 作者单位

    Department of Physics and Astronomy, King Saud University;

    Physics Department, Faculty of Science, Sohag University,Department of Physics, College of Science, Jouf University;

    Physics Department, Faculty of Science, Sohag University;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
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