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Dislocation density investigation on MOCVD-grown GaN epitaxial layers using wet and dry defect selective etching

机译:利用湿法和干法缺陷选择性刻蚀研究MOCVD生长的GaN外延层的位错密度

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摘要

Results on the investigations of the dislocation etch pits in the GaN layers grown on sapphire substrate by metal organic chemical vapor deposition are revealed by wet chemical etching, and dry etching techniques are reported. The wet etching was carried out in molten KOH, and inductively coupled plasma (ICP) was used for dry etching. We show that ICP using dry etching and wet chemical etching using KOH solution under optimal conditions give values of dislocation density comparable to the one obtained from the high-resolution X-ray diffraction, atomic force microscopy and transmission electron microscopy investigations. Investigated threading dislocation density is in the order of ~ 10~9/cm~2 using different techniques.
机译:通过湿法化学刻蚀揭示了通过金属有机化学气相沉积在蓝宝石衬底上生长的GaN层中的位错刻蚀坑的研究结果,并且报道了干刻蚀技术。在熔融的KOH中进行湿蚀刻,并且将电感耦合等离子体(ICP)用于干蚀刻。我们表明,在最佳条件下使用干法蚀刻和使用KOH溶液进行湿法化学蚀刻的ICP可以提供与高分辨率X射线衍射,原子力显微镜和透射电子显微镜研究获得的位错密度相当的值。使用不同的技术,研究的螺纹位错密度约为10〜9 / cm〜2。

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  • 来源
    《Applied Physics》 |2016年第6期|614.1-614.10|共10页
  • 作者单位

    Solid State Physics Laboratory, Lucknow Road, Delhi 110054, India,Department of Physics and Centre for Nanotechnology, Indian Institute of Technology Roorkee, Roorkee 247667, India;

    Solid State Physics Laboratory, Lucknow Road, Delhi 110054, India;

    Defence Metallurgical Research Laboratory, Kanchanbagh Post, Hyderabad 500058, India;

    Department of Physics and Centre for Nanotechnology, Indian Institute of Technology Roorkee, Roorkee 247667, India;

    Solid State Physics Laboratory, Lucknow Road, Delhi 110054, India;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
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  • 正文语种 eng
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