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Thermoreflectance microscopy analysis on self-heating effect of short-channel amorphous In-Ga-Zn-O thin film transistors

机译:短沟道非晶In-Ga-Zn-O薄膜晶体管自热效应的热反射显微镜分析

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摘要

Self-heating effect is recently considered to play an essential role in the degradation of amorphous oxide thin film transistors (TFTs). Previous thermal analysis on amorphous oxide TFTs based on conventional infrared thermography, however, had limitations in studying short-channel TFTs due to its low spatial-resolution. Here, we investigated self-heating effect of short-channel amorphous In-Ga-Zn-O TFTs by using high-resolution thermoreflectance microscopy. For the TFT with a channel length of 15 μm and a distance of 10.8 μm between source and drain electrodes on an etch stopper, the device temperature due to self-heating reached 70–80 °C, and local heating arose close to the center of the channel compared to the drain side in the literature. The channel length dependence of thermal distribution revealed that the asymmetry of local heating weakened with the decreasing channel length due to a heat dissipation by the source and drain electrodes. Transient thermal analysis under a bias stress unveiled that the maximum temperature as a function of stress time strongly depends on bias stress conditions. The temporal behavior of temperature is possibly attributed to the interaction between self-heating and local degradation.
机译:最近,人们认为自热效应在非晶氧化物薄膜晶体管(TFT)的退化中起着至关重要的作用。但是,基于传统红外热成像技术的非晶氧化物TFT的先前热分析由于其低空间分辨率而在研究短通道TFT方面存在局限性。在这里,我们通过高分辨率热反射显微镜研究了短通道非晶In-Ga-Zn-O TFT的自热效应。对于沟道长度为15μm且蚀刻停止层上的源电极和漏电极之间的距离为10.8μm的TFT,由于自热而引起的器件温度达到70-80°C,并且局部加热接近中心温度。与文献中的漏极侧相比,该通道。热分布对沟道长度的依赖性表明,由于源极和漏极的散热,局部加热的不对称性随着沟道长度的减小而减弱。偏置应力下的瞬态热分析表明,最高温度随应力时间的变化在很大程度上取决于偏置应力条件。温度的时间行为可能归因于自热和局部降解之间的相互作用。

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