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A 50-nm-gate-length erbium-silicided n-type Schottky barrier metal-oxide-semiconductor field-effect transistor

机译:栅极长度为50 nm的硅化n型肖特基势垒金属氧化物半导体场效应晶体管

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摘要

The theoretical and experimental current-voltage characteristics of 50-nm-gate-length erbium-silicided n-type Schottky barrier metal-oxide-semiconductor field-effect transistors (SB-MOSFETs) are discussed. The manufactured 50-nm-gate-length n-type SB-MOSFET shows large on/off current ratio with low leakage current less than 10~(-4) μA/μm. The saturation current is 120 μA/μm when drain and gate voltage is 1 and 3 V, respectively. The experimental current-voltage characteristics of 50-nm-gate-length n-type SB-MOSFET are fitted using newly developed theoretical model. From the theoretical analysis, the off- and on-current is mainly attributed to the thermionic and tunneling current, respectively. The decrease of tunneling distance at silicon/silicide Schottky junction with the increase of drain voltage gives the increase of tunneling current. This phenomenon is explained by using drain-induced Schottky barrier thickness thinning effect.
机译:讨论了栅长为50nm的硅化n型肖特基势垒金属氧化物半导体场效应晶体管(SB-MOSFET)的理论和实验电流-电压特性。栅极长度为50nm的n型SB-MOSFET的开/关电流比大,漏电流低,小于10〜(-4)μA/μm。当漏极和栅极电压分别为1和3 V时,饱和电流为120μA/μm。使用新开发的理论模型拟合了50nm栅极长度的n型SB-MOSFET的实验电流-电压特性。从理论分析来看,截止电流和导通电流分别主要归因于热电子和隧穿电流。硅/硅化物肖特基结处的隧穿距离随漏极电压的增加而减小,从而增加了隧穿电流。通过使用漏极引起的肖特基势垒厚度减薄效应可以解释这种现象。

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