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Carrier concentration dependence of Ti/Al/Pt/Au contact resistance on n-type ZnO

机译:Ti / Al / Pt / Au接触电阻对n型ZnO的载流子浓度依赖性

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摘要

Ti/Al/Pt/Au ohmic contacts on n-type ZnO with a range of carrier concentrations (7.5X 10~(15)-1.5 X 10~(20) cm~(-3)) show as-deposited specific contact resistances in the range from 3 X 10~(-4) to 8 X 10~(-7) Ω cm~2. Temperature-dependent measurements showed that the dominant transport mechanisms were tunneling in the contacts in the most highly doped films and thermionic emission in the more lightly doped films. After annealing at 200 ℃, the lowest specific contact resistance achieved was 2.2X 10~(-8) Ω cm~2. However, the contacts show evidence of reactions between the Ti and the ZnO film even for this low annealing temperature, suggesting that applications requiring good thermal stability will need metallurgy with better thermal stability.
机译:在载流子浓度范围为(7.5X 10〜(15)-1.5 X 10〜(20)cm〜(-3))的n型ZnO上的Ti / Al / Pt / Au欧姆接触显示出沉积的比接触电阻在3 X 10〜(-4)到8 X 10〜(-7)Ωcm〜2的范围内。与温度有关的测量结果表明,主要的传输机制是在掺杂程度最高的薄膜中的接触中隧穿,而掺杂程度更轻的薄膜中的热电子发射。在200℃退火后,获得的最低比电阻为2.2X 10〜(-8)Ωcm〜2。然而,即使在如此低的退火温度下,触点仍显示出Ti和ZnO膜之间发生反应的迹象,这表明要求良好热稳定性的应用将需要具有更好热稳定性的冶金。

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