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Detection of low energy single ion impacts in micron scale transistors at room temperature

机译:在室温下检测微米级晶体管中的低能量单离子撞击

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We report the detection of single ion impacts through monitoring of changes in the source-drain currents of field effect transistors at room temperature. Implant apertures are formed in the interlayer dielectrics and gate electrodes of planar, microscale transistors by electron beam assisted etching. Device currents increase due to the generation of positively charged defects in gate oxides when ions (~(121)Sb~(12+,14+) and Xe~(6+); 50-70 keV) impinge into channel regions. Implant damage is repaired by rapid thermal annealing, enabling iterative cycles of device doping and electrical characterization for the development of single atom devices and studies of dopant fluctuation effects.
机译:我们报告了通过监测室温下场效应晶体管的源-漏电流的变化来检测单个离子的影响。通过电子束辅助蚀刻,在平面,微型晶体管的层间电介质和栅电极中形成注入孔。当离子(〜(121)Sb〜(12 +,14 +)和Xe〜(6+); 50-70 keV)撞击沟道区时,由于栅极氧化物中产生带正电的缺陷而导致器件电流增加。植入物的损坏可以通过快速的热退火来修复,从而实现了器件掺杂和电特性的迭代循环,从而开发出了单原子器件并研究了掺杂物波动效应。

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