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Influence of top surface passivation on bottom-channel hole mobility of ultrathin SiGe- and Ge-on-insulator

机译:顶表面钝化对绝缘体上超薄SiGe和Ge的底部沟道空穴迁移率的影响

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Bottom-channel hole mobility was examined by a pseudo-metal-oxide-semiconductor field-effect transistors method for ultrathin SiGe-on-insulator (SGOI) and Ge-on-insulator (GOI), which were fabricated using Ge condensation by dry oxidation. By comparing samples with and without a top SiO_2 layer, we investigated the influence of top surface passivation on bottom-channel hole mobility. Mobility degradation was found in an ultrathin SGOI/GOI layer without top SiO_2 and became more serious with a decrease in the thickness of the SGOI/GOI layer, which strongly suggested that top surface passivation is necessary to evaluate accurate channel mobility. A 13-nm-thick GOI with passivation showed a high mobility value of 440 cm~2/V s.
机译:采用伪金属氧化物半导体场效应晶体管方法研究了超薄绝缘子上锗(SGOI)和绝缘子上锗(GOI)的伪金属氧化物半导体场效应晶体管方法。 。通过比较带有和不带有顶部SiO_2层的样品,我们研究了顶部表面钝化对底部通道空穴迁移率的影响。在没有顶层SiO_2的超薄SGOI / GOI层中发现迁移率降低,并且随着SGOI / GOI层厚度的减小而变得更加严重,这强烈表明顶面钝化对于评估准确的沟道迁移率是必要的。厚度为13 nm的钝化GOI具有440 cm〜2 / V s的高迁移率值。

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