机译:Ni包覆层对p-GaN上Ag基欧姆接触中Ag团聚的抑制作用
Department of Materials Science and Engineering, Division of Advanced Materials Science, Pohang University of Science and Technology (POSTECH), Pohang, Gyeongbuk 790-784, Republic of Korea;
Department of Materials Science and Engineering, Division of Advanced Materials Science, Pohang University of Science and Technology (POSTECH), Pohang, Gyeongbuk 790-784, Republic of Korea;
Department of Materials Science and Engineering, Division of Advanced Materials Science, Pohang University of Science and Technology (POSTECH), Pohang, Gyeongbuk 790-784, Republic of Korea;
Department of Materials Science and Engineering, Division of Advanced Materials Science, Pohang University of Science and Technology (POSTECH), Pohang, Gyeongbuk 790-784, Republic of Korea;
机译:镁添加剂对p-GaN上基于Ag的欧姆接触中Ag团聚的抑制作用
机译:覆盖层厚度对使用欧姆凹进技术的p-AlGaN和p-GaN上的Ni欧姆接触的电性能的影响
机译:通过更改p-InGaN覆盖层的厚度来改善p-GaN膜上的Ni非合金欧姆接触
机译:GaN LED中基于Ag的反射性p型欧姆接触的团聚
机译:研究与碳化硅的欧姆接触的形态,机理和中间层。
机译:在p-GaN上两步沉积Al掺杂的ZnO以形成欧姆接触
机译:使用Au / Ni-Zn-O金属化对P-GaN的欧姆接触
机译:通过控制mg的活化,形成与mOCVD生长的p-GaN的欧姆接触