机译:通过微结构邮票进行动力学控制的无胶转移印刷
Department of Materials Science and Engineering, Beckman Institute, and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Illinois 61801, USA;
Department of Materials Science and Engineering, Beckman Institute, and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Illinois 61801, USA;
School of Advanced Materials Science and Engineering, SKKU Advanced Institute of Nanotechnology, Sungkyunkwan University, Suwon 440-746, Republic of Korea;
Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Illinois 61801, USA;
Department of Mechanical Engineering, Northwestern University, Evanston, Illinois 60208, USA;
Department of Mechanical Engineering, Northwestern University, Evanston, Illinois 60208, USA Department of Civil and Environmental Engineering, Northwestern University, Evanston, Illinois 60208, USA;
Department of Materials Science and Engineering, Beckman Institute, and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Illinois 61801, USA Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Illinois 61801, USA Department of Chemistry, University of Illinois at Urbana-Champaign, Illinois 61801, USA;
机译:通过控制弹性邮票的弯曲半径,超薄微型半导体材料的无胶转移印刷
机译:通过控制弹性邮票的弯曲半径,超薄微型半导体材料的无胶转移印刷
机译:通过动力学控制对弹性体印模的粘附力进行转移印刷
机译:用于微型转印印刷的活性弹性体复合致密阵列印章
机译:用于确定性材料组装的高级邮票几何形状和无胶转移印刷方式。
机译:具有可逆附着力的微结构化弹性体表面及其在通过转印确定性组装中的应用实例
机译:使用液滴印花的高效转印印花用于柔性器件的鲁棒混合集成