MICROSTRUCTURE TRANSFER DEVICE, STAMP HEAD UNIT, STAMP COMPONENT FOR MICROSTRUCTURE TRANSFER, AND METHOD FOR TRANSFERRING MICROSTRUCTURE INTEGRATED COMPONENT

摘要

The present invention provides a stamp head unit which includes: a stamp component that has at least a silicone rubber film on a quartz glass substrate; a stamp component holding component that has a surface having a hole for vacuum suction of a surface of the quartz glass substrate of the stamp component; and a tubular component that has an evacuation suction hole connected in communication with the hole for vacuum suction in a state in which a vacuum can be maintained and that is bonded and secured to the stamp component holding component. Thus, the present invention provides a stamp component that can be stably secured by a simple vacuum chucking method, a stamp head unit in which stamp components can be exchanged in a short time, and a microstructure transfer device comprising the stamp component and the stamp head unit.