Microstructure transfer device, stamp head unit, stamp parts for microstructure transfer and transfer method of microstructure integrated parts

摘要

The present invention relates to a stamp part having at least a silicon-based rubber film on a quartz glass substrate, a stamp part holding part having a surface having a hole for vacuum-sucking the quartz glass substrate surface of the stamp part; A stamp head unit having an exhaust suction hole connected in communication with the hole in a state capable of maintaining a vacuum, and comprising a tubular part fixedly engaged with the stamp part holding part. Accordingly, there are provided a stamp part that can be stably fixed by a simple vacuum chuck method, a stamp head unit that can be replaced in a short time, and a microstructure transfer device having them.