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MICROSTRUCTURE TRANSFER DEVICE, STAMP HEAD UNIT, STAMP COMPONENT FOR MICROSTRUCTURE TRANSFER, AND METHOD FOR TRANSFERRING MICROSTRUCTURE INTEGRATED COMPONENT
MICROSTRUCTURE TRANSFER DEVICE, STAMP HEAD UNIT, STAMP COMPONENT FOR MICROSTRUCTURE TRANSFER, AND METHOD FOR TRANSFERRING MICROSTRUCTURE INTEGRATED COMPONENT
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机译:微结构传输装置,印模头单元,微观结构转移的印模部件,以及传递微结构集成部件的方法
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摘要
The present invention is a stamp head unit including: a stamp component including at least a silicone-based rubber film on a quartz glass substrate; a stamp-component-holding component including a surface having a hole for vacuum suction of a surface of the quartz glass substrate of the stamp component; and a tubular component having an evacuation suction hole connected to communicate with the hole for vacuum suction so as to maintain a vacuum, and being coupled and fixed with the stamp-component-holding component. This provides: a stamp component that can be fixed stably by a simple and convenient vacuum chuck system; a stamp head unit with which the stamp component can be replaced in a short time; and a microstructure-transfer apparatus provided with the stamp component and the stamp head unit.
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