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AlGaN/GaN metal-oxide-semiconductor high-electron mobility transistors with ZnO gate layer and (NH_4)_2S_x surface treatment

机译:具有ZnO栅极层和(NH_4)_2S_x表面处理的AlGaN / GaN金属氧化物半导体高电子迁移率晶体管

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摘要

The AlGaN/GaN metal-oxide-semiconductor high-electron-mobility transistors (MOS-HEMTs) with ZnO gate insulator deposited using a vapor cooling condensation system were fabricated. The AlGaN surface treatment using (NH_4)_2S_x was performed to improve the quality of the interface between the ZnO layer and AlGaN layer. The (NH_4)_2S_x-treated MOS-HEMTs exhibited a higher saturation drain-source current of 0.74 A/mm, a maximum extrinsic transconductance of 200 mS/ mm, an unit gain cutoff frequency of 9.1 GHz, a maximum frequency of oscillation of 17.1 GHz, and the Hooge's coefficient of 8.28 × 10~(-6). The improved performances of the (NH_4)_2S_x-treated MOS-HEMTs were attributed to the reduction in surface states.
机译:制备了使用气相冷却冷凝系统沉积了ZnO栅极绝缘体的AlGaN / GaN金属氧化物半导体高电子迁移率晶体管(MOS-HEMT)。进行使用(NH_4)_2S_x的AlGaN表面处理以改善ZnO层和AlGaN层之间的界面的质量。经(NH_4)_2S_x处理的MOS-HEMT表现出较高的饱和漏极-源极电流0.74 A / mm,最大非本征跨导200mS / mm,单位增益截止频率9.1 GHz,最大振荡频率17.1 GHz,胡格系数为8.28×10〜(-6)。 (NH_4)_2S_x处理的MOS-HEMT的性能提高归因于表面态的减少。

著录项

  • 来源
    《Applied Physicsletters》 |2010年第3期|P.032107.1-032107.3|共3页
  • 作者单位

    Department of Electrical Engineering, Institute of Microelectronics, National Cheng Rung University,Tainan 701, Taiwan;

    Department of Electrical Engineering and Computer Science, University of Michigan, Ann Arbor,Michigan 48109-2122, USA;

    Department of Electrical Engineering, Institute of Microelectronics, National Cheng Rung University,Tainan 701, Taiwan;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
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